Lead-free solder interconnect reliability
Lead-free solder interconnect reliability [electronic resource] /
edited by Dongkai Shangguan.
- Materials Park, OH : ASM International, 2005.
- x, 292 p. : ill.
Includes bibliographical references and index.
Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Microelectronic packaging--Reliability.
Solder and soldering.
Lead-free electronics manufacturing processes.
Electronic books.
TK7870.15 / .L425 2005
621.381/046
Includes bibliographical references and index.
Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Microelectronic packaging--Reliability.
Solder and soldering.
Lead-free electronics manufacturing processes.
Electronic books.
TK7870.15 / .L425 2005
621.381/046