Lead-free solder interconnect reliability  [electronic resource] / 
edited by Dongkai Shangguan. 
 - Materials Park, OH :  ASM International,  2005. 
 - x, 292 p. :  ill. 
<br/><br/>Includes bibliographical references and index. 
<br/><br/><br/>Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries. 
<br/><br/><label>ISBN: </label>
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<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging--Reliability.<br/>Solder and soldering.<br/>Lead-free electronics manufacturing processes.
<br/><br/><label>Index Terms--Genre/Form: </label><br/>Electronic books.
<br/><br/><label>LC Class. No.: </label>TK7870.15  / .L425 2005 
<br/><br/><label>Dewey Class. No.: </label>621.381/046