| 000 | 01320nam a22003494a 4500 | ||
|---|---|---|---|
| 001 | EBC3002391 | ||
| 003 | MiAaPQ | ||
| 006 | m o d | | ||
| 007 | cr cn||||||||| | ||
| 008 | 050525s2005 ohua sb 001 0 eng | ||
| 010 | _z 2005050106 | ||
| 020 | _z0871708167 | ||
| 035 | _a(MiAaPQ)EBC3002391 | ||
| 035 | _a(Au-PeEL)EBL3002391 | ||
| 035 | _a(CaPaEBR)ebr10320384 | ||
| 035 | _a(OCoLC)729262390 | ||
| 040 |
_aMiAaPQ _cMiAaPQ _dMiAaPQ |
||
| 050 | 4 |
_aTK7870.15 _b.L425 2005 |
|
| 082 | 0 | 4 |
_a621.381/046 _222 |
| 245 | 0 | 0 |
_aLead-free solder interconnect reliability _h[electronic resource] / _cedited by Dongkai Shangguan. |
| 260 |
_aMaterials Park, OH : _bASM International, _c2005. |
||
| 300 |
_ax, 292 p. : _bill. |
||
| 504 | _aIncludes bibliographical references and index. | ||
| 533 | _aElectronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries. | ||
| 650 | 0 |
_aMicroelectronic packaging _xReliability. |
|
| 650 | 0 | _aSolder and soldering. | |
| 650 | 0 | _aLead-free electronics manufacturing processes. | |
| 655 | 4 | _aElectronic books. | |
| 700 | 1 |
_aShangguan, Dongkai, _d1963- |
|
| 710 | 2 | _aProQuest (Firm) | |
| 856 | 4 | 0 |
_uhttps://ebookcentral.proquest.com/lib/nird-ebooks/detail.action?docID=3002391 _zClick to View |
| 999 |
_c2849 _d2849 |
||